Electronic device and method of transferring electronic element using stamping and magnetic field alignment

ABSTRACT

The present disclosure provides a method of transferring an electronic element using a stamping and magnetic field alignment technology and an electronic device including an electronic element transferred using the method. In the present disclosure, a polymer may be simultaneously coated on a plurality of electronic elements using the stamping process, and the polymer may be actively coated on the electronic elements without restrictions on process parameters such as size and spacing of the electronic elements. Moreover, the self-aligned ferromagnetic particles have an anisotropic current flow through which current flows only in the aligned direction. Therefore, the current may flow only vertically between the electronic element and the electrode, and there is no electrical short circuit between a peripheral LED element and the electrode.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. patent application Ser. No.16/996,446 filed on Aug. 18, 2020, which is incorporated by reference inits entirety.

BACKGROUND 1. Field

The present disclosure relates to a method of transferring an electronicelement using a stamping and magnetic field alignment technology and anelectronic device including an electronic element transferred using themethod, and more specifically, to a transferring method including astamping technology capable of dramatically simplifying a transferringprocess by simultaneously patterning and coating a polymer to aplurality of elements and a self-aligning technology capable of fixingand electrically connecting a micro light emitting diode (LED) elementto a lower electrode, and electronic device including an electronicelement transferred using the method.

2. Description of the Related Art

A transferring process is a process of moving an electronic element froma carrier to a substance on which other components are disposed, and isa core technology for realizing a micro LED display. Conventionally, apick-and-place transferring process, which is a method of picking up anindividual transfer element from a carrier and placing the element at adesired location of the substance, has been mainly applied.

However, in order to realize 4K resolution using the pick-and-placetransferring process, 24 million LED elements must be arranged in acircuit, which becomes more inefficient and unproductive as beingapplied to higher resolution and larger area. In addition, as the sizeand spacing of individual electronic elements are smaller, thepick-and-place machine must have higher precision, but the mechanicalprecision of the machine cannot keep up with the miniaturization ofelements and the degree of integration of the circuit. Thus, there arelimitations in transferring micro-sized electronic elements using thepick-and-place transferring process.

Accordingly, there is a need for a method and process for moreefficiently transferring a micro-sized electronic element that may meethigh-resolution and large-area applications.

SUMMARY

The present disclosure is designed to solve the conventional problems,and the present disclosure is directed to provide a technique forefficiently transferring electronic elements such as micro LEDs in anarray unit, rather than an existing pick-and-place transferring process.In addition, the present disclosure is directed to proposing a technicalmeans for two aforementioned factors involved in the micro LEDtranscription process.

A method of transferring an electronic element according to anembodiment of the present disclosure comprises: preparing a firstsubstance having an electronic element array arranged on one surfacethereof and a second substance having a polymer with ferromagneticparticles formed on one surface thereof; coating the polymer on theelectronic element array by bringing the electronic element array of thefirst substance and the polymer of the second substance into contact;preparing a third substance having an electrode formed on at least onesurface thereof and corresponding to the electronic element array;bringing the polymer coated on the electronic element array of the firstsubstance and the electrode of the third substance into contact;arranging the ferromagnetic particles in the polymer to electricallyconnect the electronic element array and the electrode by forming amagnetic field between the first substance and the third substance; andcuring the polymer to fix the state of the arranged ferromagneticparticles.

An electronic device according to another embodiment of the presentdisclosure comprises: a substance; an electrode formed on the substance;an electronic element electrically connected to the electrode; and acured polymer positioned between the electrode and the electronicelement, wherein the cured polymer includes a plurality of ferromagneticparticles arranged in one direction, and the electrode and theelectronic element are electrically connected through the plurality offerromagnetic particles.

In the present disclosure, a polymer may be simultaneously coated on aplurality of electronic elements using the stamping process, and thepolymer may be actively coated on the electronic elements withoutrestrictions on process parameters such as size and spacing of theelectronic elements. In addition, since the polymer remaining afterstamping may be recycled, the present disclosure is advantageous formass production and repetitive processes.

Moreover, the self-aligned ferromagnetic particles have an anisotropiccurrent flow through which current flows only in the aligned direction.Therefore, the current may flow only vertically between the electronicelement and the electrode, and there is no electrical short circuitbetween a peripheral LED element and the electrode. Thus, the presentdisclosure may cope with fine patterning.

The present disclosure is a high value-added technology becauseefficient electronic element transfer technology may be appliedregardless of size from small displays to large displays. Accordingly,the electronic device may realize high resolution through a high degreeof integration, and thus has a high possibility of application to futuredisplays such as augmented reality (AR), virtual reality (VR), displaysfor vehicles, flexible and stretchable displays, and the like.

The effects that can be obtained from the present disclosure are notlimited to those mentioned above, and other effects not mentioned hereinwill be clearly understood by those skilled in the art from thefollowing description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flowchart for illustrating a method of transferring anelectronic element according to an embodiment of the present disclosure.

FIGS. 2 and 3 are schematic views exemplarily showing a prepared firstsubstance and a prepared second substance according to an embodiment ofthe present disclosure.

FIGS. 4 and 5 exemplarily illustrate a process of bringing the firstsubstance and the second substance into contact according to anembodiment of the present disclosure.

FIG. 6 exemplarily shows a state where a polymer is coated on anelectronic element array according to an embodiment of the presentdisclosure.

FIG. 7 is a schematic view exemplarily showing a prepared thirdsubstance according to an embodiment of the present disclosure.

FIG. 8 shows a state where a magnetic field is formed at the electronicelement array of the first substance in contact in order to electricallyconnect the polymer to an electrode of the third substance according toan embodiment of the present disclosure.

FIGS. 9 and 10 show a state where an electronic element is transferredusing the third substance according to the transferring method describedabove according to an embodiment of the present disclosure.

FIGS. 11 to 18 show an example where an electronic element istransferred using the transferring method of FIGS. 1 to 10 according toan embodiment of the present disclosure.

DETAILED DESCRIPTION

The following detailed description of the present disclosure refer tothe accompanying drawings that show specific embodiments forimplementing the present disclosure as examples. The embodiments of thedetailed description are provided for the purpose of disclosing detaileddescriptions for those skilled in the art to implement the presentdisclosure.

Embodiments of the present disclosure may be explained as beingdifferent from each other, but it does not mean that the embodiments areexclusive from each other. For example, specific shapes, structures andcharacteristics described in connection with one embodiment of thedetailed description may be implemented in the same manner in otherembodiments without departing from the idea and scope of the presentdisclosure. In addition, it should be understood that positions orarrangements of individual components of the embodiments disclosedherein can be variously changed without departing from the idea andscope of the present disclosure. In the accompanying drawings, the sizeof each component may be exaggerated for explanation, and need not bethe same or similar to the size actually applied.

FIG. 1 is a flowchart for illustrating a method of transferring anelectronic element according to an embodiment of the present disclosure.

Referring to FIG. 1, a method of transferring an electronic elementaccording to an embodiment of the present disclosure includes preparinga first substance having an electronic element array arranged on onesurface thereof and a second substance having a polymer withferromagnetic particles formed on one surface thereof (S100); coatingthe polymer on the electronic element array by bringing the electronicelement array of the first substance and the polymer of the secondsubstance into contact (S110); preparing a third substance having anelectrode formed on at least one surface thereof and corresponding tothe electronic element array (S120); bringing the polymer coated on theelectronic element array of the first substance and the electrode of thethird substance into contact (S130); arranging the ferromagneticparticles in the polymer to electrically connect the electronic elementarray and the electrode by forming a magnetic field between the firstsubstance and the third substance (S140); and curing the polymer to fixthe state of the arranged ferromagnetic particles (S150).

First, a first substance having an electronic element array arranged onone surface thereof and a second substance having a polymer withferromagnetic particles formed on one surface thereof are prepared(S100).

FIGS. 2 and 3 are schematic views exemplarily showing a prepared firstsubstance and a prepared second substance according to an embodiment ofthe present disclosure. Specifically, FIG. 2 is a perspective view fromwhich the overall configuration of the first substance and the secondsubstance may be checked, and FIG. 3 is a cross-sectional view forillustrating the relationships among components based on one electronicelement 110.

Referring to FIGS. 2 and 3, the first substance having an electronicelement array 110 arranged on one surface thereof is prepared. On thefirst substance 100, a plurality of electronic elements 110 are arrangedin an array form. The plurality of electronic elements 110 shown inFIGS. 2 and 3 are just an example, and the number and configuration ofthe plurality of electronic elements 110 are not limited thereto.

The electronic element array 110 arranged on the first substance 100 maybe transferred at once to a substance on which other components areformed for the fabrication of an electronic device. The electronicelement array 110 may be a micro LED element. Here, the micro LED devicegenerally means a device smaller than 100 μm×100 μm (length×width).However, the present disclosure is not limited thereto, and the methodof transferring an electronic element according to the embodiment of thepresent disclosure may be applied not only to micro LED elements(horizontal type, vertical type) of various sizes and types, but also toother micro electronic elements.

The first substance 100 may be a free substance, but is not limitedthereto. The first substance 100 may be a carrier substance fordelivering the electronic element array 110 to another substance, andmay be removed after the process described later is over. The firstsubstance 100 and the electronic element array 110 may be temporarilyconnected through an adhesive layer 120. Further, each electronicelement 110 may include a contact pad 111 for electrical connection.

The second substance 200 having the polymer 210 with ferromagneticparticles 220 formed on one surface thereof is prepared. The secondsubstance 200 may be a glass substance, but is not limited thereto. Thepolymer 210 may be coated to one surface of the second substance 200through blade coating or the like. The polymer 210 may be formed on onesurface of the second substance 200 to have an area corresponding to thetotal area of the electronic element array 110. For example, the totalarea of the polymer 210 may be larger than the total area of theelectronic element array 110.

The polymer 210 coated on one surface of the second substance 200 may bean anisotropic conductive adhesive (ACA). That is, the polymer 210corresponds to a material capable of simultaneously providing mechanicaland process properties of a polymer along with electrical, magnetic andoptical properties of a metal by mixing metal particles in a polymerbinder. The polymer 210 may be a curable polymer, and may be cured by acertain temperature condition or a specific wavelength to fix a currentshape. Through the polymer 210, other components may be physicallyconnected and coupled. In other words, the polymer 210 may provide anadhesive function for fixing the electronic element 110 to othercomponents.

The ferromagnetic particles 220 distributed inside the polymer 210 aremetal particles that may provide electrical, magnetic and opticalproperties of a metal. That is, different components may be electricallyconnected through the ferromagnetic particles 220. In addition, theferromagnetic particles 220 are particles that are greatly affected byan external magnetic field, and a location inside the polymer 210 may bechanged according to the direction of the external magnetic field. Thatis, the orientation of the ferromagnetic particles 220 inside thepolymer 210 may be determined by the external magnetic field.

Next, the polymer is coated on the electronic element array by bringingthe electronic element array of the first substance and the polymer ofthe second substance into contact (S110).

FIGS. 4 and 5 exemplarily illustrate a process of bringing the firstsubstance and the second substance into contact, and FIG. 6 exemplarilyshows a state where a polymer is coated on an electronic element arrayaccording to an embodiment of the present disclosure. Specifically, FIG.4 is a perspective view from which the overall configuration of thefirst substance and the second substance may be checked, and FIG. 5 is across-sectional view for illustrating the relationships among componentsbased on one electronic element 110.

Referring to FIGS. 4 and 5, one surface of the first substance 100 andone surface of the second substance 200 may be positioned to face eachother. That is, the first substance 100 and the second substance 200 maybe positioned such that the electronic element array 110 of the firstsubstance 100 and the polymer 210 of the second substance 200 face eachother. At least one of the first substance 100 and the second substance200 may be vertically moved such that the distance between the firstsubstance 100 and the second substance 200 is reduced in a state ofbeing positioned to face each other. As the distance between the firstsubstance 100 and the second substance 200 decreases, the electronicelement array 110 of the first substance 100 and the polymer 210 of thesecond substance 200 may be brought into contact. According to thecontact, the polymer 210 is coated on the electronic element array 110of the first substance 100. That is, a portion of the polymer 210 of thesecond substance 200 is coupled to the electronic element array 110 andmoved. After the polymer 210 is moved to the surface of the electronicelement array 110 during a certain amount of time or by a sufficientamount, at least one of the first substance 100 and the second substance200 is vertically moved such that the distance between the firstsubstance 100 and the second substance 200 is increased.

Through the stamping process as described above, the electronic elementarray 110 of the first substance 100 and the polymer 210 of the secondsubstance 200 are brought into contact, and the polymer 210 of thesecond substance 200 is selectively moved to the electronic elementarray 110 of the first substance 100.

Referring to FIG. 6, it may be found that the polymer 210 is coated onthe electronic element array 110 so that the polymer 210 covers theentire contact pad 111 of the electronic element array 110. In addition,since the polymer 210 has an area corresponding to the total area of theelectronic element array 110 or an area capable of covering the entirearea of the electronic element array 110, the polymer 210 may be coatedon all electronic elements included in the electronic element array 110in a single stamping process. That is, a separate coating process forthe electronic element of a micro size included in the electronicelement array 110 is unnecessary, and the polymer 210 may be coated andapplied for physically and electrically coupling the electronic elementsjust with a single stamping process.

Here, the second substance 200 may further include a spacer 230 thatlimits a contact distance with the first substance 100. The spacer 230may be formed on one surface of the second substance 200, or may beformed in a region corresponding to the outside of the polymer 210. Forexample, the spacer 230 may be formed corresponding to an edge region ora corner region of the second substance 200, but is not limited thereto.The spacer 230 may be formed to have a certain height. By the spacer230, the conditions under which the stamping process is performed to thefirst substance 100 and the second substance 200 may be limited. Thedistance by which the first substance 100 and the second substance 200move closer or the distance for contact may be limited by the height ofthe spacer 230. That is, the degree to which the electronic elementarray 110 and the polymer 210 are brought into contact and the degree towhich the polymer 210 is coated may be determined by the spacer 230. Inaddition, the close contact of the first substance 100 and the secondsubstance 200 may be prevented by the spacer 230, so that the electronicelement array 110 may be prevented from being damaged by the stampingprocess.

Next, a third substance having an electrode corresponding to theelectronic element array formed on one surface thereof is prepared(S120).

FIG. 7 is a schematic view exemplarily showing a prepared thirdsubstance according to an embodiment of the present disclosure.Referring to FIG. 7, a third substance 300 having an electrode 310corresponding to at least the electronic element array 110 is prepared.The third substance 300 may be a substance that further includes aconfiguration necessary for the operation of the electronic element.That is, the third substance 300 corresponds to a substance thatreceives the electronic element from the first substance 100 serving asa carrier substance. The third substance 300 may be a glass substance,but is not limited thereto. The third substance 300 may be a flexiblesubstance. For example, the third substance 300 may be made of plasticor silicone rubber. That is, by transferring the electronic element ontothe flexible substance through the transferring method according to theembodiment of the present disclosure, a flexible display or astretchable display may be implemented more easily.

The electrode 310 may optimize a pattern size and spacing as desiredusing the inkjet printing technology, and a photo process using a maskis also applicable.

Next, the electronic element array 110 of the first substance 100 may betransferred to the third substance 300. The electronic element array 110of the first substance 100 may be transferred to the third substance 300and physically and electrically connected to a corresponding electrodeof the third substance 300. This transfer process is performed bybringing the polymer coated on the electronic element array of the firstsubstance and the electrode of the third substance into contact (S130);arranging the ferromagnetic particles in the polymer to electricallyconnect the electronic element array and the electrode by forming amagnetic field between the first substance and the third substance(S140); and curing the polymer to fix the state of the arrangedferromagnetic particles (S150).

FIG. 8 shows a state where a magnetic field is formed at the electronicelement array of the first substance in contact in order to electricallyconnect the polymer to an electrode of the third substance according toan embodiment of the present disclosure. FIG. 8 exemplarily shows a pairof electrodes 310 corresponding to one electronic element 110, but thefollowing process is performed simultaneously between the electronicelement array 110 of the first substance 100 and the electrode 310 ofthe corresponding third substance 300. That is, as one process isperformed, the electronic element array 110 of the first substance 100is easily transferred to the third substance 300, and physical andelectrical connections are also performed between them.

As shown in FIG. 8, the electronic element array 110 of the firstsubstance 100 may be positioned to face the electrode 310 of thecorresponding third substance 300. FIG. 9 show a state where theelectronic element is transferred to the third substance according tothe transfer method described above.

The polymer 210 coated on the electronic element array 110 of the firstsubstance 100 and the electrode 310 of the third substance 300 may bepositioned to face each other, and as at least one of the firstsubstance 100 and the third substance 300 is moved, the coated polymer210 and the electrode 310 are brought into contact. The first substance100 and the third substance 300 may be brought closer so that thepolymer 210 is sufficiently moved to the electrode 310. The thirdsubstance 300 may further include a spacer 320 that restricts thedistance between the first substance 100 and the third substance 300 tokeep the distance between the first substance 100 and the thirdsubstance 300. However, the present disclosure is not limited thereto,and in addition to a method of interposing a substance of a specificheight between two substances, an appropriate gap may be created betweentwo substances using a finely adjustable mechanical device.

In a state where the polymer 210 is sufficiently moved to electrode 310,a magnetic field is formed between the first substance 100 and the thirdsubstance 300 to arrange the ferromagnetic particles 220 in the polymer210 so that the electronic element array 110 and the electrode 310 areelectrically connected. An electrode for forming a magnetic field may bedisposed at a lower portion of the first substance 100 and an upperportion of the third substance 300, respectively, and the magnetic fieldmay be formed in a vertical direction. The ferromagnetic particles 220are rearranged in the polymer 210 to correspond to the direction of theformed magnetic field. That is, according to the magnetic field, theferromagnetic particles 220 are self-aligned in the polymer 210. Forexample, according to the magnetic field formed in the verticaldirection, the ferromagnetic particles 220 are self-aligned in thepolymer 210 in the vertical direction. The ferromagnetic particlesrearranged in the vertical direction have a pillar shape, and thecontact pad 111 of the electronic element array 110 and the electrode310 are electrically connected to each other by the rearrangedferromagnetic particles.

The polymer 210 may be cured so that the state and shape of therearranged ferromagnetic particles are fixed. If the formed magneticfield is removed, the position of the ferromagnetic particles 220 in thepolymer 210 may be changed again. In order to prevent the ferromagneticparticles 220 from moving in the polymer 210, the polymer 210 is cured.Since the state of the ferromagnetic particles 220 rearranged by curingthe polymer 210 is maintained, the electrical connection between theelectronic element array 110 and the electrode 310 may be maintained.That is, the state where the electrical flow is possible in the verticaldirection is fixed, and since the ferromagnetic pillars aligned alongthe magnetic field have anisotropic conduction characteristics, noelectrical short circuit occurs between the electrode and the element.

In addition, by curing the polymer 210, the electronic element array 110and the electrode 310 may be physically connected. That is, theelectronic element array 110 may be physically fixed to the thirdsubstance 300 through the polymer 210. The polymer 210 may be aheat-curing polymer that is cured according to a certain temperaturecondition, and S150 may include curing the polymer 210 by maintaining aconstant temperature for a period of time in a state where a magneticfield is formed. However, the present disclosure is not limited thereto,and the polymer 210 may be a photo-curing polymer that is cured by aspecific wavelength, and S150 may also include curing the polymer 210 byirradiating light of a wavelength band for curing for a period of timein a state where a magnetic field formed.

In addition, S150 may further include transferring a pressure in thevertical direction to the first substance 100 and the third substance300 to be compressed such that the vertical distance between the firstsubstance 100 and the third substance 300 is reduced. Through thecompressing, the electronic element array 110 and the electrode 310 maybe physically connected more efficiently by the polymer 210.

After S150 of curing the polymer so that the state of the arrangedferromagnetic particles is fixed, separating the first substance 100from the electronic element array 110 by removing the connection betweenthe adhesive layer 120 and the electronic element array 110 isperformed. Accordingly, the electronic element array 110 is completelytransferred to the third substance 300.

As shown in FIG. 9, it may be found that the electronic element array110 included in the corresponding conventional first substance 100 istransferred to the third substance 300 and positioned on thecorresponding electrode 310. In addition, as shown in FIG. 10,ferromagnetic particles 220′ arranged in the polymer 210 arerespectively connected to the electrode 310 and the contact pad 111 ofthe electronic element array 110, thereby enabling electrical connectiontherebetween.

An electronic device according to another embodiment of the presentdisclosure may include an electronic element transferred through thetransferring method according to FIGS. 1 to 10 described above. Theschematic configuration of the electronic device may be seen in FIGS. 9and 10. Specifically, the electronic device according to this embodimentincludes a substance 300; an electrode 310 formed on the substance; anelectronic element 110 electrically connected to the electrode 310; anda cured polymer 210 positioned between the electrode and the electronicelement, wherein the cured polymer 210 includes a plurality offerromagnetic particles 220′ arranged in one direction, and theelectrode 310 and the electronic element 110 may be electricallyconnected through the plurality of ferromagnetic particles 220′. Here,the electronic element 110 may be a micro LED.

FIGS. 11 to 18 show an example where an electronic element istransferred using the transferring method of FIGS. 1 to 10 according toan embodiment of the present disclosure. In an embodiment of FIGS. 11 to18, conditions of each component are as follows. The first substance100, the second substance 200 and the third substance 300 may beprepared as a glass substance of 700 μm. The electronic element 110corresponds to a micro LED including a contact pad, and has a verticalheight of 80 μm. The adhesive layer 120 had a thickness of 100 μm, thespacer 230 of the second substance has 180 μm, the polymer 210 of thesecond substance has 60 μm, and the spacer 320 of the third substance isas 155 μm. S100, S110, S130 and S140 are carried out at roomtemperature, S150 is carried out at 170° C. in a thermal curing process.The electrode 310 of S130 is prepared through an inkjet printingprocess.

FIGS. 11 and 12 show the electronic element 110 before and after thestamping process.

Comparing FIGS. 11 and 12, it may be seen that the polymer 210 is coatedon the electronic element 110 (micro LED) through the stamping process.Depending on the thickness condition of the polymer 210, the amount ofpolymer 210 coated on the electronic element 110 (micro LED) may bechanged.

FIGS. 13 and 14 show electrodes 310 prepared to have various widths onthe third substance 300. The electrode 310 may optimize a pattern sizeand spacing as desired using the inkjet printing technology, and a photoprocess using a mask is also applicable. For example, FIG. 13 shows asilver electrode 310 with a width of 50 μm prepared by the inkjetprinting technology, and FIG. 14 shows a silver electrode 310 with awidth of 160 μm prepared by the inkjet printing technology.

FIGS. 15 to 17 show front, rear and side views of an electronic element110 array transferred according to an embodiment of the presentdisclosure. It may be found that the electronic element array 110 (microLED array) is transferred to correspond to the electrode 310.

FIG. 18 shows an example of a photograph of an electronic device 110 inoperation manufactured using a transfer method according to anembodiment of the present disclosure. The electronic device 110 may be amicro LED, and it may be found that the micro LED emits light inresponse to a voltage applied thereto.

As described above, the present disclosure proposes an electronicelement (micro LED) transferring technology, and it is expected to bewidely used in fields such as not only small and large existing displaysbut also next-generation displays, smart fibers where a fiber and an LEDare combined, medical devices attached to or inserted into a human body,bio-contact lenses, HMD and automobiles.

The present disclosure has been described with reference to theembodiments shown in the drawings, but this is only exemplary and thoseskilled in the art can understand that various changes and modificationscan be made from the embodiments. However, it should be considered thatsuch modifications fall within the technical protection scope of thepresent disclosure. Therefore, the true technical protection scope ofthe present disclosure should be determined by the technical idea of theappended claims.

What is claimed is:
 1. A method of transferring an electronic element,comprising: preparing a first substance having an electronic elementarray arranged on one surface of the first substrate and a secondsubstance having a polymer with ferromagnetic particles formed on onesurface of the second substrate; coating the polymer on the electronicelement array by bringing the electronic element array of the firstsubstance and the polymer of the second substance into contact;preparing a third substance having an electrode formed on at least onesurface of the third substrate and corresponding to the electronicelement array; bringing the polymer coated on the electronic elementarray of the first substance and the electrode of the third substanceinto contact; arranging the ferromagnetic particles in the polymer toelectrically connect the electronic element array and the electrode byforming a magnetic field between the first substance and the thirdsubstance; and curing the polymer to fix a state of the arrangedferromagnetic particles.
 2. The method of transferring an electronicelement according to claim 1, wherein the electronic element array is amicro light emitting diode (LED) array.
 3. The method of transferring anelectronic element according to claim 1, wherein in coating the polymeron the electronic element array, the first substance and the secondsubstance are brought into contact using a stamping process.
 4. Themethod of transferring an electronic element according to claim 1,wherein the second substance further includes a spacer for restricting acontact distance between the first substance and the second substance,and the third substance further includes a spacer for restricting acontact distance between the first substance and the third substance. 5.The method of transferring an electronic element according to claim 1,wherein one surface of the first substance and the electronic elementarray are connected to each other using an adhesive layer, and after thecuring the polymer to fix the state of the arranged ferromagneticparticles, the method further comprises separating the first substancefrom the electronic element array by removing a connection between theadhesive layer and the electronic element array.
 6. The method oftransferring an electronic element according to claim 1, wherein thecuring the polymer to fix the state of the arranged ferromagneticparticles includes transferring a pressure to the first substance andthe third substance in a vertical direction so that a vertical distancebetween the first substance and the third substance is reduced.
 7. Themethod of transferring an electronic element according to claim 1,wherein the magnetic field is provided in a vertical direction betweenthe first substance and the third substance, and the ferromagneticparticles are arranged in a vertical direction due to the magnetic fieldprovided in a vertical direction.
 8. The method of transferring anelectronic element according to claim 1, wherein the polymer is cured bymeans of heat curing or photo curing.
 9. The method of transferring anelectronic element according to claim 1, wherein the third substance isa flexible substance.